Txais tos rau peb lub vev xaib!
PCBA rau sensor ntau lawm
| FOB Chaw nres nkoj | Tuam Tshoj (Mainland) |
| Lub Sijhawm Lead | 7-15 hnub |
- SMT sib dhos
- 2 teev high-speed SMT tshuab
- 2 teev tsis siv neeg tshuab luam ntawv nrog fiduciary alignment
- 2 teev ICT kuaj tshuab
- THT sib dhos
- 2 txheej ntawm yoj soldering tshuab kab
- 1 txheej tsis siv neeg cov khoom ntxig ntxig: IST-4000
- ISO 9001: 2008 Daim ntawv pov thawj
- UL ntawv pov thawj
- IPC-610D/E, chav kawm II ua raws
- ICT, AOI, functional test
- Kev tswj hwm Tshuag hauv ERP system
- 1) SMT sib dhos nrog rau BGA sib dhos
- 2) Txais SMD chips: 01005, BGA, QFP, QFN, TSOP
- 3) Qhov siab: 0.2-25mm
- 4) Min ntim: 0201
- 5) Min nrug ntawm BGA: 0.25-2.0mm
- 6) Min BGA loj: 0.1-0.63mm
- 7) Min QFP qhov chaw: 0.35mm
- 8) Min sib dhos loj: (X) 50 * (Y) 30mm
- 9) Max sib dhos loj: (X): 350 * (Y) 550mm
- 10) Pick-placement precision: ± 0.01mm
- 11) Qhov chaw muaj peev xwm: 0805, 0603, 0402, 0201
- 12) High-pin suav xovxwm haum muaj
- 13) SMT peev xwm ib hnub: 800,000 ntsiab lus
- 1) Cov khoom lag luam nruj, ua raws li tus qauv IPC-A-160
- 2) Engineering pretreatment ua ntej ntau lawm
- 3) Kev tswj cov txheej txheem ntau lawm (5ms)
- 4) 100% E-test, 100% kev kuaj pom, suav nrog IQC, IPQC, FQC, OQC
- 5) 100% AOI tshuaj xyuas, suav nrog X-ray, 3D microscope thiab ICT
- 6) High-voltage test, impedance tswj kev xeem
- 7) Microsection, soldering peev xwm, thermal stress test, shocking test
- 8) Hauv tsev PCB ntau lawm
- 9) Tsis muaj qhov txiav txim yam tsawg kawg nkaus thiab cov qauv dawb
- 10) Tsom ntsoov rau qhov qis mus rau nruab nrab ntim ntau lawm
- 11) Kev xa khoom sai thiab raws sijhawm
- - Asia
- -Australasia
- - Central / South America
- - Sab hnub tuaj Europe
- - Mid East / Africa
- - North America
- - Western Europe
Sau koj cov lus ntawm no thiab xa tuaj rau peb
