Daim ntawv thov: Aerospace, BMS, Kev sib txuas lus, Computer, Consumer Electronics, Cov khoom siv hauv tsev, LED, Cov cuab yeej kho mob, Motherboard, Smart electronics, Wireless charging
Feature: Fexible PCB, siab ceev PCB
Cov ntaub ntawv rwb thaiv tsev: Epoxy resin, Hlau Composite Materials, Organic Resin
Txheej: 1-22 txheej
Board thickness: 1.6 hli
Copper thickness: 1 OZ
Khoom siv: FR4
Qhov tsawg kawg nkaus qhov loj: 0.2mm
Yam tsawg kawg kab dav: 4 mil
Ua tiav nto: lead dawb HASL
HT-S1105DS yog mini compact soho 5 chaw nres nkoj 10/100mbps 4pin taub hau network hloov PCBA. Nws muaj 5 10/100mbps 4pin taub hau chaw nres nkoj built-in. Plug n ua si, tsis tas yuav teeb tsa. Input voltage 3.3V.
Lub hwj chim, txuas / ua cov cim qhia muab kev daws teeb meem ceev ceev.
Tus Qauv Zauv: TC280
Qeb: Nto Mount PCB Terminal Blocks
Circuits: 2 Pin
Kev ntsuas tam sim no: 3.0A
Kev ntsuas hluav taws xob: 200V
PC Board Mounting Direction: Sab nkag
Nplaim Retardant Properties: V1
Rwb thaiv tsev cov ntaub ntawv: Synthetic Resin
Khoom siv: Fiberglass Sheet
Mechanical Rigid: Fexible
Ua Tshuab: Ncua Siab Ntawv Nyiaj, Electrolytic Foil
Daim ntawv thov: Kev sib txuas lus, Khoos phis tawj, Consumer Electronics, Khoom Siv Hauv Tsev, Cov Khoom Siv Kho Mob, Motherboard, Ntse electronics, Wireless charging
Feature: Fexible PCB, siab ceev PCB
Cov khoom siv rwb thaiv tsev: Epoxy resin, Hlau Composite cov ntaub ntawv
Khoom siv: Fiberglass Epoxy Resin & Polyimide Resin
Ua Tshuab: Ncua Siab Ntawv Nyiaj, Electrolytic Foil
Daim ntawv thov: Aerospace, BMS, Kev sib txuas lus, Computer, Consumer Electronics, Cov khoom siv hauv tsev, LED, Cov cuab yeej kho mob, Motherboard, Smart electronics, Wireless charging
Feature: Fexible PCB, siab ceev PCB
Cov ntaub ntawv rwb thaiv tsev: Epoxy resin, Hlau Composite Materials, Organic Resin
Khoom siv: Aluminium Npog Copper Foil Txheej, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Ntawv Phenolic Copper Foil Substrate, Synthetic Fiber
Ua Tshuab: Ncua Siab Ntawv Nyiaj, Electrolytic Foil
Peb yog cov chaw tsim khoom pcb thiab pcb los ua ke ib-nres kev pabcuam factories. muaj 400 tus neeg tag nrho. 20% nce muag ntim txhua xyoo. 70% ntau lawm los ntawm txawv teb chaws. peb ua 1-12layer.FR4.CEM-1.CEM-3.HDI. AL khoom.
Aerospace, Kev sib txuas lus, Khoos phis tawj, Consumer Electronics, Cov khoom siv hauv tsev, LED, Cov Khoom Siv Kho Mob, Motherboard, Ntse electronics, Wireless charging
Nplaim Retardant Properties: V0, V1, V2
Cov ntaub ntawv rwb thaiv tsev: Epoxy resin, Hlau Composite Materials, Organic Resin
Khoom siv: Complex, Fiberglass Epoxy, Ntawv Phenolic Copper Foil Substrate, Synthetic Fiber, Daim Ntawv Ring Gas Resin
Mechanical Rigid: Fexible
Feature: Rigid Flex pcb
Txheej: Multilayer
Daim ntawv thov:
Aerospace, BMS, Kev sib txuas lus, Computer, Consumer Electronics, Khoom Siv Hauv Tsev, LED, Cov Khoom Siv Kho Mob, Motherboard, Ntse electronics, Wireless charging
Cov khoom siv rwb thaiv tsev:
Epoxy Resin, Hlau Composite Khoom, Organic Resin
Khoom siv:
Aluminium Npog Copper Foil Txheej, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Ntawv Phenolic Copper Foil Substrate, Synthetic Fiber
Kev Siv Tshuab:
Delay Pressure Foil, Electrolytic Foil