OEM PCBA Clone Assembly Service Lwm PCB & PCBA Custom Electronics PCB Circuit Board Featured duab

OEM PCBA Clone Assembly Service Lwm yam PCB & PCBA Custom Electronics PCB Circuit Board

Lus piav qhia luv luv:

Daim ntawv thov: Aerospace, BMS, Kev sib txuas lus, Computer, Consumer Electronics, Cov khoom siv hauv tsev, LED, Cov cuab yeej kho mob, Motherboard, Smart electronics, Wireless charging

Feature: Fexible PCB, siab ceev PCB

Cov ntaub ntawv rwb thaiv tsev: Epoxy resin, Hlau Composite Materials, Organic Resin

Khoom siv: Aluminium Npog Copper Foil Txheej, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Ntawv Phenolic Copper Foil Substrate, Synthetic Fiber

Ua Tshuab: Ncua Siab Ntawv Nyiaj, Electrolytic Foil

Xa email rau peb

Product Detail

Khoom cim npe

Specification

PCB Technical Peev xwm

Txheej pawg ntau lawm: 2 ~ 58 txheej / Pilot khiav: 64 txheej

Max. Thickness Loj: 394mil (10mm) / Pilot khiav: 17.5mm

Cov ntaub ntawv FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead free sib dhos khoom), Halogen-Free, Ceramic puv, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Ib nrab hybrid, thiab lwm yam

Min. Dav/Spacing Sab hauv txheej: 3mil / 3mil (HOZ), Txheej txheej: 4mil / 4mil (1OZ)

Max. Copper Thickness 6.0 OZ / Pilot khiav: 12OZ

Min. Qhov Loj Mechanical laum: 8mil (0.2mm) Laser laum: 3mil (0.075mm)

Nto Finish HASL, Immersion Kub, Immersion Tin, OSP, ENIG + OSP, Immersion, ENEPIG, Kub ntiv tes

Cov txheej txheem tshwj xeeb faus qhov, qhov muag tsis pom kev, Embedded Resistance, Embedded Capacity, Hybrid, Ib nrab hybrid, Ib nrab siab ceev, Rov qab drilling, thiab kev tswj tsis kam

PCBA technical peev

Qhov zoo ---- Kev tshaj lij nto-mounting thiab dhau-lub qhov soldering tshuab

---- Ntau qhov ntau thiab tsawg xws li 1206,0805,0603 Cheebtsam SMT tshuab

---- ICT (In Circuit Test), FCT (Functional Circuit Test)

---- PCB los ua ke Nrog UL, CE, FCC, Rohs pom zoo

---- Nitrogen gas reflow soldering tshuab rau SMT.

---- High Standard SMT & Solder Assembly Kab

---- High density interconnected board placement technology peev xwm.

Cheebtsam Passive Down rau 0201 loj, BGA thiab VFBGA, Leadless Chip Carriers / CSP

Ob-sided SMT Sib dhos, Fine Pitch rau 0.8mils, BGA Kho thiab Reball

Kuaj Flying Probe Test, X-ray Inspection AOI Test

SMT txoj hauj lwm raug	20 awm
Cheebtsam loj	0.4 × 0.2mm (01005) - 130 × 79mm, Flip-CHIP, QFP, BGA, POP
Max. tiv thaiv qhov siab	25 hli
Max. PCB loj	680 × 500 hli
Min. PCB loj	tsis txwv
PCB thickness	0.3 rau 6mm
Wave-Solder Max. PCB dav	450 hli
Min. PCB dav	tsis txwv
Cheebtsam qhov siab	Sab saum toj 120mm / Bot 15mm
Sweat-Solder Hlau hom	part, tag nrho, inlay, sidestep
Cov khoom siv hlau	Tooj, Aluminium
Nto tiav	plating Au, , plating Sn
Cua zais zis tus nqi	tsawg dua 20%
Xovxwm-haum Xovxwm ntau	0-50 KN
Max. PCB loj	800 x 600 mm