Keyboard pcb board siv rau Cov Khoom Siv Kho Mob nrog BGA sib dhos nrog ISO 13485
Los ntawm complex multi-layer board mus rau ob sab saum npoo mount tsim, peb lub hom phiaj yog los muab koj cov khoom zoo uas ua tau raws li koj xav tau thiab yog tus nqi tsim nyog tshaj plaws.
Peb cov kev paub dhau los hauv IPC chav kawm III cov qauv, kev ua kom huv huv nruj heev, hnyav tooj liab thiab kev ua haujlwm ntev tso cai rau peb muab peb cov neeg siv khoom raws nraim qhov lawv xav tau rau lawv cov khoom kawg.
Advanced technology khoom:
Backplanes, HDI boards, high-frequency boards, siab TG boards, halogen-dawb boards, saj zawg zog thiab nruj-flex boards, hybrids thiab tej boards nrog daim ntaub ntawv nyob rau hauv high-tech khoom
20-txheej PCB, 2 mil kab dav sib nrug:
Peb muaj 10-xyoo kev tsim khoom, cov cuab yeej ua haujlwm siab thiab cov cuab yeej ntsuas tau ua rau VIT tsim 20-txheej cov laug cam thiab rigid-flex circuits mus txog 12 txheej.
Backplane thicknesses mus txog .276 (7mm), nam piv mus txog 20: 1, 2/2 kab / qhov chaw thiab impedance tswj tsim yog tsim txhua hnub
Cov khoom siv thiab kev siv technology:
Siv rau kev sib txuas lus, aerospace, tiv thaiv, IT, cov cuab yeej kho mob, cov cuab yeej ntsuas qhov tseeb thiab cov tuam txhab tswj kev lag luam
Cov txheej txheem rau kev ua PCBs:Kev tshuaj xyuas thiab kev xeem yuav ua raws li IPC-A-600 thiab IPC-6012, chav kawm 2 tshwj tsis yog tias tau teev tseg rau cov neeg siv khoom kos duab lossis cov lus qhia tshwj xeeb
PCB tsim kev pabcuam:VIT kuj tuaj yeem muab kev pabcuam tsim PCB rau peb cov neeg siv khoom
Qee zaum, peb cov neeg siv khoom tsuas yog muab cov ntaub ntawv 2D rau peb lossis tsuas yog ib lub tswv yim, ces peb yuav tsum tsim cov PCB, layout thiab ua cov ntaub ntawv Gerber rau lawv.
| Yam khoom | Kev piav qhia | Kev muaj peev xwm |
| 1 | Txheej | 1-20 txheej |
| 2 | Max board loj | 1200x600mm (47x23 ") |
| 3 | Khoom siv | FR-4, siab TG FR4, halogen dawb khoom, Rogers, Arlon, PTFE, Taconic, ISOLA, ceramics, txhuas, tooj liab puag |
| 4 | Max board thickness | 330 hli (8.4mm) |
| 5 | Min sab hauv kab dav / qhov chaw | 3mil (0.075mm) / 3mil (0.075 hli) |
| 6 | Min txheej kab dav / qhov chaw | 3mil (0.75mm) / 3mil (0.075 hli) |
| 7 | Min tiav qhov loj | 4mil (0.10 hli) |
| 8 | Min ntawm qhov loj thiab ncoo | Txoj kab uas hla: 0.2mm Pad: txoj kab uas hla 0.4mm HDI <0.10mm ntawm |
| 9 | Min qhov kam rau ua | ± 0.05 hli (NPTH), ± 0.076 hli (PTH) |
| 10 | Ua tiav qhov qhov loj me (PTH) | ± 2mil (0.05 hli) |
| 11 | Ua tiav qhov qhov loj me (NPTH) | ± 1mil (0.025 hli) |
| 12 | Qhov txoj hauj lwm deviation kam rau ua | ± 2mil (0.05 hli) |
| 13 | Min S/M pitch | 3mil (0.075 hli) |
| 14 | Solder mask hardness | ≥ 6 H |
| 15 | Flammability | 94v 0 |
| 16 | Nto xov | OSP, ENIG, flash kub, immersion tin, HASL, tin-plated, immersion nyiaj,carbon number case, tshem tawm daim npog ntsej muag, ntiv tes kub (30μ"), immersion nyiaj (3-10u"), immersion tin (0.6-1.2um) |
| 17 | V-txiav kaum sab xis | 30/45/60 °, kam rau ua ± 5 ° |
| 18 | Min V-txiav board thickness | 0.75mm ib |
| 19 | Min dig muag / faus via | 0.15 hli (6mil) |
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