Zoo siab ENIG PCB rau cov khoom siv kho mob Aerospace tub rog tiv thaiv cheeb tsam kub tuab 1u "-3u"

Peb yog cov chaw tsim khoom pcb thiab pcb los ua ke ib-nres kev pabcuam factories. muaj 400 tus neeg tag nrho. 20% nce muag ntim txhua xyoo. 70% ntau lawm los ntawm txawv teb chaws. peb ua 1-12layer.FR4.CEM-1.CEM-3.HDI. AL khoom. peb txais tos prototypes xaj. ib txwm pcb kuaj txog 3 hnub tuaj yeem xa tuaj peb tuaj yeem xa tuaj rau koj li ntawm 12 teev lossis 24 teev them tus nqi ceev. pcba prototypes txog 1 hnub tuaj yeem xa tuaj. smt thiab dip thiab los ntawm tes cov khoom txhua tus tuaj yeem ua tau. suav nrog 0201 Cheebtsam.BGA. 100% Kev cog lus zoo. vim Fly soj ntsuam. E-testing txee.X-RAY.AOI. Kev xeem ua haujlwm rau txhua lub rooj tsavxwm. peb tuaj yeem tsim qauv tsim lossis luam lub rooj tsavxwm yog tias tsis muaj pcb gerber cov ntaub ntawv thiab cov npe bom. koj tuaj yeem xa koj cov qauv ua ntej rau peb yog tias muaj. thov muab daim duab shematic. daim ntawv loj. cov ntaub ntawv seem yog tias tsis muaj cov qauv tseeb. peb paub tseeb tias kho lossis rov tsim dua lossis dais cov teeb meem zoo yog tias qhov zoo ua rau peb sab. ib qho lus teb yuav teb tsis pub dhau 5 teev. peb muaj ISO9001.TS16949.SGS.UL. ROHS ntawv pov thawj. Nrhiav forwarder kom hnov ​​los ntawm koj sai sai. txais tos koj qhov kev thov sai sai.

Technical parameters
• Khoom siv: FR-4, CEM-3, CEM-1, AL, HDI, Halogen-dawb, Ceramic boards
•Min Solder Mask Choj: 0.1mm
•Min/max Solder Mask thickness: 10um-25um
•Min tuav txoj kab uas hla: 0.1mm (ib sab)
Txoj kab uas hla: PTH ± 0.076mm NPTH ± 0.05mm
• Tenting los ntawm Mask (yog / tsis): Yog
• Txheej suav: 1-12 LAYERS
• Board Thickness: 0.4mm-3.5mm
Thickness kam rau ua (t≥0.8mm): 0.8 +/-0.1mm; 1.2-1.6 +/-0.13mm; 2.4 +/-0.18mm; 3.2 +/-0.25mm
•Thickness kam rau ua (T<0.8mm): 0.4-0.6 +/-0.1mm
• Yam tsawg kawg nkaus (0.5OZ): 0.10mm (rau plating kub): Yam tsawg kawg nkaus (0.5OZ) 0.10mm (rau plating kub)
• Kab Tsawg (1OZ): 0.15mm: Yam tsawg kawg nkaus (2OZ): 0.20mm
• Yam tsawg kawg nkaus Kab (3OZ): 0.25mm: Qhov Chaw Tsawg (1OZ): 0.15mm
• Qhov chaw tsawg kawg nkaus (2OZ): 0.20mm
• Qhov chaw tsawg kawg nkaus (3OZ): 0.25mm
•Out Txheej Copper Thickness: 0.5-2OZ
• Pem hauv ntej Copper Thickness: 0.5-2OZ
•Min Drilling Qhov (Tiav): 0.25mm
•Annular nplhaib: 0.1mm Kev Sau Npe: ± 0.1mm
•Aspect Ratio: Los ntawm Qhov - 8:1
•Solder Mask xim: Ntsuab, dub, liab, dawb. Mini. Solder Mask Clearance: 0.05mm
•Legend xim: Ntsuab, dawb, liab, daj, dub.
•Maximum Board Loj: 500x600mm
•Twist thiab Hneev (rau SMT sib dhos): ≤0.75%
Thickness Tin / Lead HASL: 5-25um