Txheej | 1-2 Txheej |
Ua tiav Thickness | 16-134 hli (0.4mm-3.4mm) |
Max. Dimension | 500mm * 1200 hli |
Tooj Thickness | 35um, 70um, 1 txog 10oZ |
Min Kab Dav / Qhov Chaw | 4mil (0.1 hli) |
Min Qhov Loj Qhov Loj | 0.95mm ib |
Min. Drill Size | 1.00 hli |
Max. Drill Size | 6.5mm ib |
Tiav Qhov Qhov Loj Tolerance | ± 0.050 hli |
Aperture Position Precision | ± 0.076 hli |
Min SMT PAD Loj | 0.4 hli ± 0.1 hli |
Min.Solder Mask PAD | 0.05 hli (2mil) |
Min.Solder Mask Cover | 0.05 hli (2mil) |
Solder daim npog qhov ncauj Thickness | > 12 awm |
Nto Finishing | HAL, HAL Lead free, OSP, Immersion Kub, thiab lwm yam |
HAL Thickness | 5-12 hli |
Immersion Kub Thickness | 1-3 mil |
OSP Film Thickness | ENTEK PLUS HT: 0.3-0.5um; F2: 0.15-0.3um |
Cov txheej txheem tiav | Routing & Punching; Precision sib txawv ± 0.10mm |
Thermal conductivity | 1.0-12 w/mk |
FOB Chaw nres nkoj | Shenzhen |
Export Carton Dimensions L / W / H | 36 x 26 x 25 cm |
Lub Sijhawm Lead | 3-7 hnub |
Chav nyob rau Export Carton | 5.0 |
Export Carton Nyhav | 18 Kilogram |