Qhia txog kev muaj peev xwm ua tau:
1. Phaj thickness:
0.3MM ~ 3.0MM (tsawg kawg 0.15mm, siab tshaj plaws thickness tuaj yeem ua raws li cov neeg siv khoom xav tau)
2. Ink:
Cov roj ntsuab, roj xiav, roj dub, roj dawb, roj butter liab, ntshav, matte dub
3. Nto tshuab: Anti-oxidation (SOP), leaded tin spray, lead-free tin spray, immersion kub, kub plating, nyiaj plating, npib tsib xee plating, kub ntiv tes,tshebbon vaj
4. Cov cuab yeej tshwj xeeb: impedance board, siab zaus board, faus qhov muag tsis pom qhov board (qhov tsawg kawg nkaus qhov 0.1 hli laser qhov)
Qauv: customized
Tus naj npawb ntawm cov khoom txheej: ntau txheej
Insulating khoom: organic resin
nplaim retardant kev ua tau zoo: VO board
Reinforcement khoom: fiberglass ntaub puag
Mechanical rigidity: nruj
Khoom siv: tooj liab
Rwb thaiv tsev txheej thickness: nyias phaj
Kev siv technology: Calendered ntawv ci
Insulating cob: polyimide cob (PI)
Cov txheej txheem ntau lawm: 1 ~ 10 txheej
Qhov siab tshaj plaws: 600X600mm
Yam tsawg kawg nkaus: ± 0.15mm
Layman's kam rau ua: 0.4 ~ 3.2mm
Phaj thickness specification: ± 10%
Board txwv kab dav: 5MIL (0.127mm)
Board txwv kab nrug: 5MIL (0.127mm)
Tiav tooj liab thickness: 1OZ (35UM)
Mechanical Drilling: 0.25 ~ 6.3 hli
Aperture kam rau ua: ± 0.075mm
Yam tsawg kawg nkaus: dav ≥ 0.15mm / qhov siab ≥ 0.85n
Qhov deb ntawm kab mus rau cov qauv: ≥12MIL (0.3mm)
Solder mask hom: photosensitive number case/matte ink
Tsis muaj vaj huam sib luag: Omm
Vaj huam sib luag nrug: 1.5mm
Ib-nres PCBA kev pabcuam, xa khoom sai.